Methods and devices for preventing thermally-induced stress cracks in large footprint solid oxide fuel cell columns

ABSTRACT

A method of making an interconnect for an electrochemical cell stack includes providing the interconnect, and creep flattening the interconnect prior to placing the interconnect into the electrochemical cell stack.

FIELD

This disclosure is directed to fuel cell stacks in general, and to fuel cell interconnects in particular.

BACKGROUND

In a high temperature fuel cell system, such as a solid oxide fuel cell (SOFC) system, an oxidizing flow is passed through the cathode side of the fuel cell while a fuel flow is passed through the anode side of the fuel cell. The oxidizing flow is typically air, while the fuel flow can be a hydrocarbon fuel, such as methane, natural gas, pentane, ethanol, or methanol. The fuel cell, operating at a typical temperature between 750° C. and 950° C., enables the transport of negatively charged oxygen ions from the cathode flow stream to the anode flow stream, where the ion combines with either free hydrogen or hydrogen in a hydrocarbon molecule to form water vapor and/or with carbon monoxide to form carbon dioxide. The excess electrons from the negatively charged ion are routed back to the cathode side of the fuel cell through an electrical circuit completed between anode and cathode, resulting in an electrical current flow through the circuit.

Fuel cell stacks may be either internally or externally manifolded for fuel and air. In internally manifolded stacks, the fuel and air is distributed to each cell using risers contained within the stack. In other words, the gas flows through openings or holes in the supporting layer of each fuel cell, such as the electrolyte layer, and gas flow separator of each cell. In externally manifolded stacks, the stack is open on the fuel and air inlet and outlet sides, and the fuel and air are introduced and collected independently of the stack hardware. For example, the inlet and outlet fuel and air flow in separate channels between the stack and the manifold housing in which the stack is located.

Fuel cell stacks are frequently built from a multiplicity of cells in the form of planar elements, tubes, or other geometries. Fuel and air has to be provided to the electrochemically active surface, which can be large. One component of a fuel cell stack is the so called gas flow separator (referred to as a gas flow separator plate in a planar stack) that separates the individual cells in the stack. The gas flow separator plate separates fuel, such as hydrogen or a hydrocarbon fuel, flowing to the fuel electrode (i.e., anode) of one cell in the stack from oxidant, such as air, flowing to the air electrode (i.e., cathode) of an adjacent cell in the stack. Frequently, the gas flow separator plate is also used as an interconnect which electrically connects the fuel electrode of one cell to the air electrode of the adjacent cell. In this case, the gas flow separator plate which functions as an interconnect is made of or contains an electrically conductive material.

SUMMARY

According to one embodiment, a method of making an interconnect for an electrochemical cell stack includes providing the interconnect and creep flattening the interconnect prior to placing the interconnect into the electrochemical cell stack.

According to another embodiment, an interconnect for an electrochemical cell stack comprises fuel inlets and outlets that extend through the interconnect adjacent to opposing first and second peripheral edges of the interconnect, an air side comprising an air flow field comprising air-side ribs and air channels that extend in a first direction, from a third peripheral edge of the interconnect to a fourth peripheral edge of the interconnect that is opposite to the third peripheral edge, and riser seal surfaces disposed on the first and second peripheral edges of the interconnect, wherein the riser seal surfaces surround the fuel inlets and outlets, a fuel side opposing the air side, the fuel side comprising a fuel flow field comprising fuel-side ribs and fuel channels that extend in a second direction substantially perpendicular to the first direction between the fuel inlets and outlets, and a coating comprising at least one of lanthanum strontium manganite (LSM) or (Mn, Co)₃O₄ spinel (MCO) located on the air-side ribs but not on the riser seal surfaces, wherein the riser seal surfaces are recessed with respect to a plane extending across a top surface of the coating on tips of the air-side ribs.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate example embodiments of the disclosure, and together with the general description given above and the detailed description given below, serve to explain the features of the disclosure.

FIG. 1A is a perspective view of a conventional fuel cell column.

FIG. 1B is a perspective view of one counter-flow solid oxide fuel cell stack included in the column of FIG. 1A.

FIG. 1C is a side cross-sectional view of a portion of the stack of FIG. 1B.

FIG. 2A is a top view of the air side of a conventional interconnect of the stack of FIG. 1B.

FIG. 2B is a top view of the fuel side of the conventional interconnect of the stack of FIG. 1B.

FIG. 3A is a perspective view of a fuel cell stack, according to various embodiments.

FIG. 3B is an exploded perspective view of a portion of the stack of FIG. 3A, according to various embodiments.

FIG. 3C is a top view of the fuel side of an interconnect included in the stack of FIG. 3A, according to various embodiments.

FIG. 3D is a schematic view of a fuel cell included in the stack of FIG. 3A, according to various embodiments.

FIG. 4A is a plan view showing an air side of the cross-flow interconnect of FIG. 3C, according to various embodiments.

FIG. 4B is a plan view showing an fuel side of the cross-flow interconnect of FIG. 3C, according to various embodiments.

FIG. 5 is a plan view showing the air side of the interconnect without the riser seals, according to various embodiments.

FIG. 6A is a sectional perspective view of two interconnects of FIGS. 4A and 4B, and a fuel cell as assembled in the fuel cell stack of FIG. 3A, according to various embodiments.

FIG. 6B is a top view showing overlap of a fuel cell and seals on the fuel side of the interconnect of FIG. 6A, according to various embodiments.

FIG. 7 is a plan view of a portion of SOFC stack containing a SOFC (shown by dashed lines in transparent view) overlying the interconnect, according to various embodiments.

FIG. 8A is a vertical cross-sectional view of a portion of the interconnect of FIG. 7 , according to various embodiments.

FIG. 8B is a vertical cross-sectional view of the portion of the interconnect of FIG. 8A after a coating has been applied to air side ribs, according to various embodiments.

FIG. 8C is a vertical cross-sectional view of a portion of the interconnect of FIG. 7 having a different height profile from that of FIG. 8A, according to various embodiments.

FIG. 8D is a vertical cross-sectional view of the portion of the interconnect of FIG. 8C after a coating has been applied to air side ribs, according to various embodiments.

DETAILED DESCRIPTION

The various embodiments are described in detail with reference to the accompanying drawings. The drawings are not necessarily to scale, and are intended to illustrate various features of the disclosure. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. References made to particular examples and implementations are for illustrative purposes, and are not intended to limit the scope of the disclosure or the claims.

Ranges can be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, examples include from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about” or “substantially” it will be understood that the particular value forms another aspect. In some embodiments, a value of “about X” may include values of +/−1% X. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.

FIG. 1A is a perspective view of a conventional fuel cell column 30, FIG. 1B is a perspective view of one counter-flow SOFC stack 20 included in the column 30 of FIG. 1A, and FIG. 1C is a side cross-sectional view of a portion of the stack 20 of FIG. 1B.

Referring to FIGS. 1A and 1B, the column 30 may include one or more stacks 20, a fuel inlet conduit 32, an anode exhaust conduit 34, and anode feed/return assemblies 36 (e.g., anode splitter plates (ASP's) 36). The column 30 may also include side baffles 38 and a compression assembly 40. The side baffles 38 may be connected to the compression assembly 40 and an underlying stack component (not shown) by ceramic connectors 39. The fuel inlet conduit 32 is fluidly connected to the ASP's 36 and is configured to provide the fuel feed to each ASP 36, and anode exhaust conduit 34 is fluidly connected to the ASP's 36 and is configured to receive anode fuel exhaust from each ASP 36.

The ASP's 36 are disposed between the stacks 20 and are configured to provide a hydrocarbon fuel containing fuel feed to the stacks 20 and to receive anode fuel exhaust from the stacks 20. For example, the ASP's 36 may be fluidly connected to internal fuel riser channels 22 formed in the stacks 20, as discussed below.

Referring to FIG. 1C, the stack 20 includes multiple fuel cells 1 that are separated by interconnects 10, which may also be referred to as gas flow separator plates or bipolar plates. Each fuel cell 1 includes a cathode electrode 3, a solid oxide electrolyte 5, and an anode electrode 7.

Each interconnect 10 electrically connects adjacent fuel cells 1 in the stack 20. In particular, an interconnect 10 may electrically connect the anode electrode 7 of one fuel cell 1 to the cathode electrode 3 of an adjacent fuel cell 1. FIG. 1C shows that the lower fuel cell 1 is located between two interconnects 10.

Each interconnect 10 includes ribs 12 that at least partially define fuel channels 8A and air channels 8B. The interconnect 10 may operate as a gas-fuel separator that separates a fuel, such as a hydrocarbon fuel, flowing to the fuel electrode (i.e. anode 7) of one cell in the stack from oxidant, such as air, flowing to the air electrode (i.e. cathode 3) of an adjacent cell in the stack. At either end of the stack 20, there may be an air end plate or fuel end plate (not shown) for providing air or fuel, respectively, to the end electrode.

FIG. 2A is a top view of the air side of the conventional interconnect 10, and FIG. 2B is a top view of a fuel side of the interconnect 10. Referring to FIGS. 1C and 2A, the air side includes the air channels 8B. Air flows through the air channels 8B to a cathode electrode 3 of an adjacent fuel cell 1. In particular, the air may flow across the interconnect 10 in a first direction A as indicated by the arrows.

Ring seals 23 may surround fuel holes 22A of the interconnect 10, to prevent fuel from contacting the cathode electrode. Peripheral strip-shaped seals 24 are located on peripheral portions of the air side of the interconnect 10. The seals 23, 24 may be formed of a glass material. The peripheral portions may be in the form of an elevated plateau which does not include ribs or channels. The surface of the peripheral regions may be coplanar with tops of the ribs 12.

Referring to FIGS. 1C and 2B, the fuel side of the interconnect 10 may include the fuel channels 8A and fuel manifolds 28 (e.g., fuel plenums). Fuel flows from one of the fuel holes 22A, into the adjacent manifold 28, through the fuel channels 8A, and to an anode 7 of an adjacent fuel cell 1. Excess fuel may flow into the other fuel manifold 28 and then into the adjacent fuel hole 22A. In particular, the fuel may flow across the interconnect 10 in a second direction B, as indicated by the arrows. The second direction B may be perpendicular to the first direction A (see FIG. 2A).

A frame-shaped seal 26 is disposed on a peripheral region of the fuel side of the interconnect 10. The peripheral region may be an elevated plateau which does not include ribs or channels. The surface of the peripheral region may be coplanar with tops of the ribs 12.

Accordingly, a conventional counter-flow fuel cell column, as shown in FIGS. 1A, 1B, 1C, 2A, and 2B, may include complex fuel distribution systems (fuel rails and anode splitter plates). In addition, the use of an internal fuel riser may require holes in fuel cells and corresponding seals, which may reduce an active area thereof and may cause cracks in the ceramic electrolytes of the fuel cells 1.

The fuel manifolds 28 may occupy a relatively large region of the interconnect 10, which may reduce the contact area between the interconnect 10 and an adjacent fuel cell by approximately 10%. The fuel manifolds 28 are also relatively deep, such that the fuel manifolds 28 represent relatively thin regions of the interconnect 10. Since the interconnect 10 is generally formed by a powder metallurgy compaction process, the density of fuel manifold regions may approach the theoretical density limit of the interconnect material. As such, the length of stroke of a compaction press used in the compaction process may be limited due to the high-density fuel manifold regions being incapable of being compacted further. As a result, the density achieved elsewhere in the interconnect 10 may be limited to a lower level by the limitation to the compaction stroke. The resultant density variation may lead to topographical variations, which may reduce the amount of contact between the interconnect 10 a fuel cell 1 and may result in lower stack yield and/or performance.

Another important consideration in fuel cell system design is in the area of operational efficiency. Maximizing fuel utilization is a key factor to achieving operational efficiency. Fuel utilization is the ratio of how much fuel is consumed during operation, relative to how much is delivered to a fuel cell. An important factor in preserving fuel cell cycle life may be avoiding fuel starvation in fuel cell active areas, by appropriately distributing fuel to the active areas. If there is a maldistribution of fuel such that some flow field channels receive insufficient fuel to support the electrochemical reaction that would occur in the region of that channel, it may result in fuel starvation in fuel cell areas adjacent that channel. In order to distribute fuel more uniformly, conventional interconnect designs include channel depth variations across the flow field. This may create complications not only in the manufacturing process, but may also require complex metrology to measure these dimensions accurately. The varying channel geometry may be constrained by the way fuel is distributed through fuel holes and distribution manifolds.

One possible solution to eliminate this complicated geometry and the fuel manifold is to have a wider fuel opening to ensure much more uniform fuel distribution across the fuel flow field. Since fuel manifold formation is a factor in density variation, elimination of fuel manifolds should enable more uniform interconnect density and permeability. Accordingly, there is a need for improved interconnects that provide for uniform contact with fuel cells, while also uniformly distributing fuel to the fuel cells without the use of conventional fuel manifolds.

Owing to the overall restrictions in expanding the size of a hotbox of a fuel cell system, there is also a need for improved interconnects designed to maximize fuel utilization and fuel cell active area, without increasing the footprint of a hotbox.

FIG. 3A is a perspective view of a fuel cell stack 300, according to various embodiments, FIG. 3B is an exploded perspective view of a portion of the stack 300 of FIG. 3A, FIG. 3C is a top view of the fuel side of an interconnect 400 included in the stack 300, and FIG. 3D is a schematic view of a fuel cell included in the stack 300.

Referring to FIGS. 3A-3D, the fuel cell stack 300, which may also be referred to as a fuel cell column because it lacks ASP's, includes multiple fuel cells 310 that are separated by interconnects 400, which may also be referred to as gas flow separator plates or bipolar plates. One or more stacks 300 may be thermally integrated with other components of a fuel cell power generating system (e.g., one or more anode tail gas oxidizers, fuel reformers, fluid conduits and manifolds, etc.) in a common enclosure or “hotbox.”

The interconnects 400 are made from an electrically conductive metal material. For example, the interconnects 400 may comprise a chromium alloy, such as a Cr—Fe alloy. The interconnects 400 may typically be fabricated using a powder metallurgy technique that includes pressing and sintering a Cr—Fe powder, which may be a mixture of Cr and Fe powders or an Cr—Fe alloy powder, to form a Cr—Fe interconnect in a desired size and shape (e.g., a “net shape” or “near net shape” process). A typical chromium-alloy interconnect 400 comprises more than about 90% chromium by weight, such as about 94-96% (e.g., 95%) chromium by weight. An interconnect 400 may also contain less than about 10% iron by weight, such as about 4-6% (e.g., 5%) iron by weight, may contain less than about 2% by weight, such as about zero to 1% by weight, of other materials, such as yttrium or yttria, as well as residual or unavoidable impurities. In another embodiment, the interconnects 400 may comprise a 3 to 3.9 weight percent iron, such as 3 to 3.7 weight percent, for example 3.2 to 3.5 weight percent iron, 96.1 to 97 weight percent chromium, such as 96.5 to 96.8 weight percent chromium, and residual or unavoidable impurities alloy. This alloy may provide an improved CTE match to larger area SOFCs.

Each fuel cell 310 may include a solid oxide electrolyte 312, an anode 314, and a cathode 316. In some embodiments, the anode 314 and the cathode 316 may be printed on the electrolyte 312. In other embodiments, a conductive layer 318, such as a nickel mesh, may be disposed between the anode 314 and an adjacent interconnect 400. The fuel cell 310 does not include through-holes, such as the fuel holes of conventional fuel cells. Therefore, the fuel cell 310 avoids cracks that may be generated due to the presence of such through-holes.

An upper most interconnect 400 and a lowermost interconnect 400 of the stack 300 may be different ones of an air end plate or fuel end plate including features for providing air or fuel, respectively, to an adjacent end fuel cell 310. As used herein, an “interconnect” may refer to either an interconnect located between two fuel cells 310 or an end plate located at an end of the stack and directly adjacent to only one fuel cell 310. Since the stack 300 does not include ASPs and the end plates associated therewith, the stack 300 may include only two end plates. As a result, stack dimensional variations associated with the use of intra-column ASPs may be avoided.

The stack 300 may include side baffles 302, a fuel plenum 350, and a compression assembly 306. The side baffles 302 may be formed of a ceramic material and may be disposed on opposing sides of the fuel cell stack 300 containing stacked fuel cells 310 and interconnects 400. The side baffles 302 may connect the fuel plenum 350 and the compression assembly 306, such that the compression assembly 306 may apply pressure to the stack 300. The side baffles 302 may be curved baffle plates, such each baffle plate covers at least portions of three sides of the fuel cell stack 300. For example, one baffle plate may fully cover the fuel inlet riser side of the stack 300 and partially covers the adjacent front and back sides of the stack, while the other baffle plate fully covers the fuel outlet riser side of the stack and partially covers the adjacent portions of the front and back sides of the stack. The remaining uncovered portions for the front and back sides of the stack allow the air to flow through the stack 300. The curved baffle plates provide an improved air flow control through the stack compared to the conventional baffle plates 38 which cover only one side of the stack. The fuel plenum 350 may be disposed below the stack 300 and may be configured to provide a hydrogen-containing fuel feed to the stack 300, and may receive an anode fuel exhaust from the stack 300. The fuel plenum 350 may be connected to fuel inlet and outlet conduits 320 which are located below the fuel plenum 350.

Each interconnect 400 electrically connects adjacent fuel cells 310 in the stack 300. In particular, an interconnect 400 may electrically connect the anode electrode of one fuel cell 310 to the cathode electrode of an adjacent fuel cell 310. As shown in FIG. 3C, each interconnect 400 may be configured to channel air in a first direction A, such that the air may be provided to the cathode of an adjacent fuel cell 310. Each interconnect 400 may also be configured to channel fuel in a second direction F, such that the fuel may be provided to the anode of an adjacent fuel cell 310. Directions A and F may be perpendicular, or substantially perpendicular. As such, the interconnects 400 may be referred to as cross-flow interconnects.

The interconnect 400 may include fuel holes that extend through the interconnect 400 and that are configured for fuel distribution. For example, the fuel holes may include one or more fuel inlets 402 and one or more fuel (e.g., anode exhaust) outlets 404, which may also be referred to as anode exhaust outlets 404. The fuel inlets and outlets 402, 404 may be disposed outside of the perimeter of the fuel cells 310. As such, the fuel cells 310 may be formed without corresponding through-holes for fuel flow. The combined length of the fuel inlets 402 and/or the combined length of the fuel outlets 404 may be at least 75% of a corresponding length of the interconnect 400 e.g., a length taken in direction A.

In one embodiment, each interconnect 400 contains two fuel inlets 402 separated by a neck portion 412 of the interconnect 400, as shown in FIG. 3B. However, more than two fuel inlets 402 may be included, such as three to five inlets separated by two to four neck portions 412. In one embodiment, each interconnect 400 contains two fuel outlets 404 separated by a neck portion 414 of the interconnect 400, as shown in FIG. 3B. However, more than two fuel outlets 404 may be included, such as three to five outlets separated by two to four neck portions 414.

The fuel inlets 402 of adjacent interconnects 400 may be aligned in the stack 300 to form one or more fuel inlet risers 403. The fuel outlets 404 of adjacent interconnects 400 may be aligned in the stack 300 to form one or more fuel outlet risers 405. The fuel inlet riser 403 may be configured to distribute fuel received from the fuel plenum 350 to the fuel cells 310. The fuel outlet riser 405 may be configured to provide anode exhaust received from the fuel cells 310 to the fuel plenum 350.

Unlike the flat related art side baffles 38 of FIG. 1A, the side baffles 302 may be curved around edges of the interconnects 400. In particular, the side baffles 302 may be disposed around the fuel inlets 402 and outlets 404 of the interconnects 400. Accordingly, the side baffles may more efficiently control air flow through air channels of the interconnects 400, which are exposed between the side baffles 302 and are described in detail with regard to FIGS. 4A and 4B.

In various embodiments, the stack 300 may include at least 30, at least 40, at least 50, or at least 60 fuel cells, which may be provided with fuel using only the fuel risers 403, 405. In other words, as compared to a conventional fuel cell system, the cross-flow configuration allows for a large number of fuel cells to be provided with fuel, without the need for ASP's or external stack fuel manifolds, such as external conduits 32, 34 shown in FIG. 1A.

Each interconnect 400 may be made of or may contain electrically conductive material, such as a metal alloy (e.g., chromium-iron alloy) which has a similar coefficient of thermal expansion to that of the solid oxide electrolyte in the cells (e.g., a difference of 0-10%). For example, the interconnects 400 may comprise a metal (e.g., a chromium-iron alloy, such as 3-6 weight percent iron, optionally 1 or less weight percent yttrium and balance chromium alloy), and may electrically connect the anode or fuel-side of one fuel cell 310 to the cathode or air-side of an adjacent fuel cell 310. In one embodiment, the interconnects 400 may comprise a 4-6 weight percent iron, optionally 1 or less weight percent yttrium and balance chromium and residual or unavoidable impurities alloy. In another embodiment, the interconnects 400 may comprise a 3 to 3.9 weight percent iron, such as 3 to 3.7 weight percent, for example 3.2 to 3.5 weight percent iron, 96.1 to 97 weight percent chromium, such as 96.5 to 96.8 weight percent chromium, and residual or unavoidable impurities alloy. This alloy may provide an improved CTE match to larger area SOFCs. An electrically conductive contact layer, such as a nickel contact layer (e.g., a nickel mesh), may be provided between anode and each interconnect 400. Another optional electrically conductive contact layer may be provided between the cathode electrodes and each interconnect 400.

A surface of an interconnect 400 that in operation is exposed to an oxidizing environment (e.g., air), such as the cathode-facing side of the interconnect 400, may be coated with a protective coating layer in order to decrease the growth rate of a chromium oxide surface layer on the interconnect and to suppress evaporation of chromium vapor species which can poison the fuel cell cathode. Typically, the coating layer, which can comprise a perovskite such as LSM, may be formed using a spray coating or dip coating process. Alternatively, other metal oxide coatings, such as a spinel, such as an (Mn, Co)₃O₄ spinel (MCO), can be used instead of or in addition to LSM. Any spinel having the composition Mn_(2−x)Co_(1+x)O₄(0≤x≤1) or written as z(Mn₃O₄)+(1-z)(Co₃O₄), where (⅓≤z≤⅔) or written as (Mn, Co)₃O₄ may be used. In other embodiments, a mixed layer of LSM and MCO, or a stack of LSM and MCO layers may be used as the coating layer.

FIGS. 4A and 4B are plan views showing, respectively, an air side and a fuel side of the cross-flow interconnect 400, according to various embodiments. Referring to FIG. 4A, the air side of the interconnect 400 may include ribs 406 configured to at least partially define air channels 408 configured to provide air to the cathode of a fuel cell 310 disposed thereon. The air side of the interconnect 400 may be divided into an air flow field 420 including the air channels 408, and riser seal surfaces 422 disposed on two opposing sides of the air flow field 420. One of the riser seal surfaces 422 may surround the fuel inlets 402 and the other riser seal surface 422 may surround the fuel outlets 404. The air channels 408 and ribs 406 may extend completely across the air side of the interconnect 400, such that the air channels 408 and ribs 406 terminate at opposing peripheral edges of the interconnect 400. In other words, when assembled into a stack 300, opposing ends of the air channels 408 and ribs 406 are disposed on opposing (e.g., front and back) outer surfaces of the stack, to allow the blown air to flow through the stack. Therefore, the stack may be externally manifolded for air.

Riser seals 424 may be disposed on the riser seal surface 422. For example, one riser seal 424 may surround the fuel inlets 402, and one riser seal 424 may surround the fuel outlets 404. The riser seals 424 may prevent fuel and/or anode exhaust from entering the air flow field 420 and contacting the cathode of the fuel cell 310. The riser seals 424 may also operate to prevent fuel from leaking out of the fuel cell stack 100 (see FIG. 3A).

Referring to FIG. 4B, the fuel side of the interconnect 400 may include ribs 416 that at least partially define fuel channels 418 configured to provide fuel to the anode of a fuel cell 310 disposed thereon. The fuel side of the interconnect 400 may be divided into a fuel flow field 430 including the fuel channels 418, and an perimeter seal surface 432 surrounding the fuel flow field 430 and the fuel inlets and outlets 402, 404. The ribs 416 and fuel channels 418 may extend in a direction that is perpendicular or substantially perpendicular to the direction in which the air-side channels 408 and ribs 406 extend.

A frame-shaped perimeter seal 434 may be disposed on the perimeter seal surface 432. The perimeter seal 434 may be configured to prevent air entering the fuel flow field 430 and contacting the anode on an adjacent fuel cell 310. The perimeter seal 434 may also operate to prevent fuel from exiting the fuel risers 403, 405 and leaking out of the fuel cell stack 300 (see FIGS. 3A and 3B).

The seals 424, 434 may comprise a glass or ceramic seal material. The seal material may have a low electrical conductivity. In some embodiments, the seals 424, 434 may be formed by printing one or more layers of seal material on the interconnect 400, followed by sintering.

In some embodiments, the seals 424, 434 may be formed of a silicate glass seal material comprising SiO₂, BaO, CaO, Al₂O₃, K₂O, and/or B₂O₃. For example, the seal material may include, by weight: SiO₂ in an amount ranging from about 40% to about 60%, such as from about 45% to about 55%; BaO in an amount ranging from about 10% to about 35%, such as from about 15% to about 30%; CaO in an amount ranging from about 5% to about 20%, such as from about 7% to about 16%; Al₂O₃ in an amount ranging from about 10% to about 20%, such as from about 13% to about 15%; and B₂O₃ in an amount ranging from about 0.25% to about 7%, such as from about 0.5% to about 5.5%. In some embodiments, the seal material may additionally include K₂O in an amount ranging from about 0.5% to about 1.5%, such as from about 0.75% to about 1.25%.

In some embodiments, the seals 424, 434 may be formed of a silicate glass seal material comprising SiO₂, B₂O₃, Al₂O₃, CaO, MgO, La₂O₃, BaO, and/or SrO. For example, the seal material may include, by weight: SiO₂ in an amount ranging from about 30% to about 60%, such as from about 35% to about 55%; B₂O₃ in an amount ranging from about 0.5% to about 15%, such as from about 1% to about 12%; Al₂O₃ in an amount ranging from about 0.5% to about 5%, such as from about 1% to about 4%; CaO in an amount ranging from about 2% to about 30%, such as from about 5% to about 25%; MgO in an amount ranging from about 2% to about 25%, such as from about 5% to about 20%; and La₂O₃ in an amount ranging from about 2% to about 12%, such as from about 5% to about 10%. In some embodiments, the seal material may additionally include BaO in an amount ranging from about 0% to about 35%, such as from about 0% to about 30%, or from about 0.5% to about 30%, including about 20% to about 30%, and/or SrO in an amount ranging from about 0% to about 20%, such as from about 0% to about 15%, of from about 0.5% to about 15%, including about 10% to about 15%. In some embodiments, the seal material may additionally include at least one of BaO and/or SrO in a non-zero amount such as at least 0.5 wt. %, such as both of BaO and SrO in a non-zero amount, such at least 0.5 wt. %.

FIG. 5 is a plan view showing the air side of the interconnect 400 without the riser seals 424, according to various embodiments. In conventional counter flow fuel cell system designs, the fuel cell electrolytes fully cover the interconnects, such that the fuel cell electrolytes operate as dielectric layers between adjacent interconnects. In a crossflow design, interconnects may extend past the perimeter of the fuel cells. This can potentially result in electrical shorting between interconnects, if the stack is tilted, or if seals become conductive over time.

Referring to FIG. 5 , the interconnect 400 may include dielectric layers 440 disposed on the riser seal surfaces 422. For example, as shown in FIG. 5 , each dielectric layer 440 may be annular and may cover all, or substantially all, of the corresponding riser seal surface 422. For example, in the embodiment of FIG. 5 , the dielectric layers 440 may be D-shaped and may have substantially the same shape as the riser seals 424 shown in FIG. 4A disposed thereon. In other embodiments (not shown), the dielectric layers 440 may cover only a portion of the corresponding riser seal surface 422. The dielectric layers 440 form an electrically insulating barrier between adjacent interconnects 400 and prevent electrical shorting if a corresponding stack is tilted or if a seal becomes conductive.

The dielectric layers 440 may comprise alumina, zircon (zirconium silicate), silicon carbide, crystalline glass (e.g., quartz or a glass-ceramic), or other high temperature dielectric materials. In some embodiments, the dielectric layers 440 may include a corrosion barrier material or layer. For example, the dielectric layers 440 may comprise a composite material comprising a corrosion-tolerant glass, alumina, zircon, or the like. For example, in some embodiments the dielectric layers 440 comprise a glass ceramic layer formed from a substantially glass barrier precursor layer containing at least 90 wt. % glass (e.g., 90-100 wt. % glass, such as around 99 to 100 wt. % amorphous glass and 0 to 1 wt. % crystalline phase) applied to a surface of interconnect 400 in the SOFC stack 300. In one embodiment, the glass barrier precursor layer containing at least 90 wt. % glass comprises: 45-55 wt. % silica (SiO₂); 5-10 wt. % potassium oxide (K₂O); 2-5 wt. % calcium oxide (CaO); 2-5 wt. % barium oxide (BaO); 0-1 wt. % boron trioxide (B₂O₃); 15-25 wt. % alumina (Al₂O₃); and 20-30 wt. % zirconia (ZrO₂) on an oxide weight basis.

In some embodiments, the glass barrier precursor layer comprises least 90% glass (e.g., 90-100 wt. % glass, such as around 99 to 100 wt. % amorphous glass and 0 to 1 wt. % crystalline phase) by weight. For example, the glass barrier precursor layer may comprise, on an oxide weight basis: from about 30% to about 60%, such as from about 35% to about 55%, silica (SiO₂); from about 0.5% to about 15%, such as from about 1% to about 12%, boron trioxide (B₂O₃); from about 0.5% to about 5%, such as from about 1% to about 4%, alumina (Al₂O₃); from about 2% to about 30%, such as from about 5% to about 25%, calcium oxide (CaO); from about 2% to about 25%, such as from about 5% to about 20% magnesium oxide (MgO); from about 0% to about 35%, such as from about 20% to about 30%, barium oxide (BaO); from about 0% to about 20%, such as from about 10% to about 15%, strontium oxide (SrO); and from about 2% to about 12%, such as from about 5% to about 10%, lanthanum oxide (La₂O₃). In some embodiments, the glass barrier precursor material may include at least one of BaO and/or SrO in a non-zero amount such as at least 0.5 wt. %, such as both of BaO and SrO in a non-zero amount, such at least 0.5 wt. %.

In some embodiments, some or all of a LSM/MCO coating may be removed on the air side of the interconnect 400 in the area around the riser seal 424, to prevent Mn diffusion from the LSM/MCO material into the riser seal 424, and thereby prevent the riser seal 424 from becoming conductive. In other embodiments, the riser seals 424 may be formed of crystalline glass or glass-ceramic materials that do not react with the LSM/MCO coating, such as the borosilicate glass-ceramic compositions discussed above.

The dielectric layer 440 can be formed from freestanding layers, such as a tape cast and sintered layer, and may be disposed between interconnects 400 during fuel cell stack assembly. In other embodiments, the dielectric layers 440 may be formed by dispersing a dielectric material in an ink, paste, or slurry form, and subsequently screen printed, pad printed, aerosol sprayed onto the interconnect 400. In some embodiments, the dielectric layer 440 may be formed by a thermal spraying process, such as an atmospheric plasma spray (APS) process. For example, the dielectric layer 440 may include alumina deposited by the APS process.

The dielectric layer 440 may be deposited directly on the interconnect 400. For example, the dielectric layer 440 may be disposed directly on the riser seal surfaces 422 (i.e., parts of the interconnect 400 around the fuel inlets and outlets 402, 404 in areas that will be covered by the riser seals 424 and that are not covered by the LSM/MCO coating, except for a small area of overlap (e.g., seam) where the dielectric layer 440 overlaps with a LSM/MCO coating where the riser seal surface 422 meets the air flow field 420, so as to prevent Cr evaporation from an exposed surface of the interconnect 400. Thus, the LSM/MCO coating is located on the interconnect 400 surface in the air flow field 420 containing air channels 408 and ribs 406, but not in the riser seal surface 422 of the interconnect 400 surrounding the fuel inlets and outlets 402, 404. The dielectric layer 440 is located on the riser seal surface of the interconnect 400 in the area surrounding the fuel inlets and outlets 402, 404 that is not covered by the LSM/MCO coating and on the edge of the LSM/MCO coating in the air flow field 420 adjacent to the riser seal surface 422. Alternatively, the dielectric layer 440 may be omitted and there is no dielectric layer 440 deposited around the fuel riser openings.

FIG. 6A is a sectional perspective view of two interconnects 400 of FIGS. 4A and 4B, and a fuel cell 310 as assembled in the fuel cell stack 300 of FIG. 3A, according to various embodiments. FIG. 6B is a top view showing the overlap of the fuel cell 310, and seals 424, 434, on the fuel side of an interconnect 400 of FIG. 6A.

Referring to FIGS. 4A, 4B, 6A, and 6B, when assembled in a fuel cell stack, the fuel cell 310 is disposed between the interconnects 400, so as to face the air flow field 420 and the fuel flow field 430 of each interconnect 400. The riser seals 424 may contact first opposing sides of the air side of the fuel cell 310, and the perimeter seal 434 may contact second opposing sides of the fuel side of the fuel cell 310. As such, portions of the seals 424, 434 may be thicker outside of the perimeter of the fuel cell 310 than inside of the perimeter of (e.g., overlapping with) the fuel cell 310. Portions of the perimeter seal 434 adjacent the fuel inlets and outlets 402, 404 may overlap with corresponding portions of the riser seals 424. In addition, portions of the fuel cell 310 may be disposed between overlapping portions of the seals 424, 434, such as at corners of the fuel cell 310. As such, a combined thickness of the overlapped portions of the fuel cell 310 and seals 424, 434 may be greater than a thickness of the overlapped portions of the seals 424, 434.

In order to account for this thickness variation and/or properly seal the fuel cell stack, the thickness of portions of the interconnects 400 that are disposed outside of the perimeter of the fuel cell 310 may be increased by an amount equal to the after-sintering thickness of the fuel cell 310 (e.g., the after-sintering thickness of the electrodes 314, 316, electrolyte 312, and nickel mesh 318 as shown in FIG. 3D).

Since the seals 424, 434 overlap the corners of the fuel cell 310, a gap G may be formed between the corners, below each of the riser seals 424 (e.g., below the electrolyte 312). When the stack 300 is compressed, a down force may be transmitted through the interconnect 400 and riser seals 424, and into the unsupported edges of the fuel cell 310 adjacent the gaps G, which may create a leaver arm effect, due to the adjacent gaps G below the riser seals 424.

Conventionally, the electrodes and conductive layer of a fuel cell are only disposed on an active region of the fuel cell (e.g., where the fuel cell is exposed to fuel and air). In other words, seals may be disposed on portions of the electrolyte that are not covered with the electrodes and/or conductive layer.

According to various embodiments, in order to support the edges of the fuel cell 310, the conductive layer 318 (e.g., nickel mesh) may be extended into the gaps G. In some embodiments, the anode 314 and/or cathode 316 may also be extended to cover the electrolyte below the riser seals 424, in combination with extending the conductive layer 318 into the gaps G. In other embodiments, one or more electrolyte reinforcement layers 325 may be formed on one or both sides of the electrolyte 312 below the riser seals 424, and may be formed of a ceramic material, such as alumina and/or zirconia. The electrolyte reinforcement layer 325 may have substantially the same thickness as the anode 314 and/or cathode 316, and may further support the edge of the fuel cell 310 in conjunction with the conductive layer 318. In some embodiments, the electrolyte reinforcement layer 325 may be disposed on the cathode-side of the fuel cell 310 and may be formed of a chromium getter material, such as manganese cobalt oxide spinel. As such, the electrolyte reinforcement layer 325 may be configured to remove chromium from air supplied to the fuel cell 310.

The fuel cell stack 300 and/or components thereof may be conditioned and/or sintered. “Sintering” includes processes for heating, melting and/or reflowing a glass or glass-ceramic seal precursor materials to form seals in a fuel cell stack, which may be performed at elevated temperature (e.g., 600-1000° C.) in air/inert gas. “Conditioning” includes processes for reducing a metal oxide (e.g., nickel oxide) in an anode electrode to a metal (e.g., nickel) in a cermet electrode (e.g., nickel and a ceramic material, such as a stabilized zirconia or doped ceria) and/or heating the stack 300 during performance characterization/testing, and may be performed at elevated temperature (e.g., 750-900° C.) while fuel flows through the stack. The sintering and conditioning of the fuel cell stack 300 may be performed during the same thermal cycle (i.e., without cooling the stack to room temperature between sintering and conditioning).

During such high-temperature operations, if too much pressure is applied to the riser seals 424, the riser seals 424 may be forced out of the riser seal surfaces 422, past the edges of the fuel cell 310, and into the fuel inlets 402, the fuel outlets 404, and/or the fuel channels 418 of an adjacent interconnect 400. In severe cases, this can increase the pressure drop of fuel flow, cause fuel maldistribution from cell to cell, or even render the stack 300 unusable.

Accordingly, in some embodiments, the riser seal surfaces 422 may be recessed with respect to the tops of the air-side ribs 406. In other words, when the air side of the interconnect 400 is viewed from above, the riser seal regions may be lower than the tips of the ribs 406. For example, the riser seal surfaces 422 may be recessed by from about 30 to about 50 microns with respect to a plane extending across the tips of the ribs 406. Accordingly, when the fuel cell 310, which may have a thickness ranging from about 20-30 microns, for example, is brought into contact with the air side of the interconnect 400, the ribs 406 contact with the fuel cell 310, and a space or recess may be formed between the fuel cell 310 and each of the riser seal surfaces 422.

When the fuel cell stack 300 is assembled, the recessed riser seal surfaces 422 provide additional space to accommodate the riser seals 424. As a result, the force applied to the riser seals 424 may be reduced, such that the riser seals 424 may remain in the riser seal surfaces 422 during high temperature operations such as sintering. In some embodiments, one or more components of the fuel cell 310 may be made thicker, such as by contact printing to form thicker contact printed fuel cell layers. This increased thickness may also reduce the force applied to the riser seals 424. In some embodiments, a thicker fuel cell 310 may be used in conjunction with the recessed riser seal surface 422.

In various embodiments, a chamfer 407 may be added to the fuel inlets 402 and/or the fuel outlets 404 on the air side of the interconnect 400. The chamfer 407 may operate to capture seal material that has escaped from the riser seal surface 422. Chamfers 409 may also be added to other edges of the interconnect 400, such as edges of the inlets and outlets 402, 404 on the fuel side of the interconnect 400 and/or perimeter edges of the interconnect 400, for example. The chamfers may provide benefits during formation of the interconnect 400, such as preventing chipping during powdered metallurgy operations used to form the interconnect 400.

The thermal gradient across the fuel cell 310 during steady state operations is a function of the operating condition, including I²R heating, endothermic steam reformation (mainly at fuel inlets 402), and convective cooling (e.g., the coolest air contacts the inlets of the air channels 408), as well as physical properties of the stack 300, such as thermal conductivity and thickness of the interconnects 400. As a result, certain portions of the fuel cell 310 may be relatively hot during steady-state operations, such as the corner (hot corner) adjacent to the fuel inlet 402 and the air channel 408 outlets at the fuel in/air out corner. Portions of the seals 424, 434 adjacent to this corner may become porous and/or leak, due to evaporation at the relatively elevated temperature at this corner, particularly when a barium-containing borosilicate glass seal material is used.

According to various embodiments, the seals 424, 434 may be formed of glass materials that are stable at high temperatures, such as the glass materials described above. In the alternative, the thickness of the interconnects 400 may be increased to improve thermal conduction in the in-plane direction. The increased thickness may reduce the thermal gradient of the interconnects 400 and thereby reduce the temperature of the hot corner. The thickness of the interconnects 400 may be increased without increasing the overall thickness of the stack 300, as compared to a conventional stack, since the stack does not require the anode splitter plates of the conventional stack.

The present inventors realized that SOFCs often crack during initial operation of a SOFC stack, such as during an initial current draw, heat up and/or preliminary conditioning of the SOFC stack with metal alloy interconnects. Without wishing to be bound by a particular theory, the present inventors believe that SOFC cracks may comprise stress-induced cracks which result due to a large thermal gradient that may build up across the SOFC. Such cracks may result in fuel/air mixing, burning, excessive heat generation, and eventually cell failure.

Without wishing to be bound by a particular theory, the present inventors believe that camber (i.e., lack of flatness) and/or higher porosity in large area, powder pressed interconnects in the SOFC stack may cause or exacerbate the stress-induced cracks in the SOFCs which contact the interconnects in the stack. Specifically, the cambered and/or lower density interconnects are believed to be subjected to a larger and faster lateral movement relative to the SOFCs in the stack due to the high thermal gradients across the SOFC during the first current ramp on the stack. These thermal gradients may create thermal stresses between the SOFC electrolytes and the interconnects due to differences in their coefficient of thermal expansion (CTE). This may force the SOFCs into tension (i.e., apply a tensile stress on the SOFC) and crack the SOFCs beyond their tensile strength.

Therefore, in one embodiment, the interconnects are subjected to a creep flattening process to increase the interconnect flatness and reduce interconnect camber and stress-induced cracks in the SOFCs in the SOFC stack. During the creep flattening, the interconnects are subjected to an elevated temperature (e.g., above room temperature) under a load (i.e., under physical pressure from a load (i.e., weight) applied to the interconnects). The creep flattening improves the interconnect flatness and reduces interconnect camber. Thus, it is believed that the creep flattening of the interconnects prior to placing the interconnects into a SOFC stack reduces lateral movement of the interconnects relative to the SOFCs in the stack, which may reduce stress-induced cracking of the SOFCs in the SOFC stack during the initial stack current draw, heat up and/or preliminary conditioning (e.g., during seal reflow and/or reduction of SOFC metal oxide (e.g., nickel oxide) anodes to metal (e.g., nickel) during a thermal anneal of the SOFC stack in a reducing ambient).

FIG. 7 is a plan (i.e., top) view of a portion of SOFC stack containing the SOFC 310 (shown by dashed lines in transparent view) overlying the interconnect 400, as described above. The interconnect 400 of this embodiment may include three rather than two respective fuel inlets 402 and fuel outlets 404 described above. Alternatively, two or more than three fuel inlets 402 and fuel outlets 404 may be provided. The air side ribs 406 of the interconnect 400 are shown below the SOFC 310.

As described above, if the cambered interconnect 400 not properly creep flattened prior to its placement in the stack, then the cambered interconnect 400 may cause large tensile stresses that may lead to the development of cracks 702 in the SOFC 310 during operation of the SOFC stack (e.g., during a first current draw of the stack). The development of cracks 702 may occur in greater numbers for SOFCs 310 that are located lower in the stack and therefore are subjected to the dead weight of interconnects 400 further up in the stack.

In one embodiment, the creep flattening may be conducted in an oxidizing ambient (e.g., air, pure oxygen, water vapor, etc., ambient) to oxidize the interconnects. Without wishing to be bound by a particular theory, the present inventors believe that the oxidation reduces porosity of the interconnect by filling the pores with an oxide of the metal of the interconnect, and may also reduce camber of the interconnect. Furthermore, without wishing to be bound by a particular theory, it is believed that the high temperature oxidation during the creep flattening causes metal oxide formation and the associated geometric distortion of the interconnect prior to sealing the interconnect to the SOFCs in the stack. During subsequent high temperature operation of the SOFC stack, physical distortion of the interconnects in the stack due to oxidation is reduced or eliminated, and the stresses on the SOFCs in the stack are reduced compared to SOFC stacks containing non-preoxidized interconnects. Thus, the creep flattening and optional oxidation during the creep flattening is performed on the interconnect prior to placing the interconnect into the SOFC stack.

While SOFC stacks are described above, it should be understood that the interconnect creep flatting may also be used for other electrolytic stacks, such as solid oxide electrolyzer stacks which contain ceramic electrolyte solid oxide electrolyzer cells (SOECs) interspersed with the creep flattened metal interconnects.

For solid oxide fuel cell and electrolyzer stacks, the interconnect may include a chromium-iron alloy, such as a Cr—Fe—Y alloy made by powder metallurgy techniques, such as by pressing and sintering a Cr—Fe—Y powder. The alloy may include 3 to 6 weight percent iron, such as 4.5 to 5.5 weight percent Fe, 0 to 1 weight percent or less yttrium, such as 200 to 2000 micrograms/gram of Y, with the balance including chromium and residual or unavoidable impurities. The impurities may be absent or may include one or more of O, H, Al, Si, N and/or C in a total amount of less than 1 weight percent, such as less than 0.1 weight percent. In one embodiment, the interconnect comprises a chromium alloy comprising 4 to 6 weight percent iron, 0 to 1 weight percent yttrium, and 94 to 96 weight percent chromium, and the interconnect is formed by a powder metallurgy method. In one embodiment, the Y may be omitted and the interconnect comprises about 5 weight percent Fe with the balance Cr (e.g., about 95 weight percent Cr), and optionally unavoidable impurities. In another embodiment, the alloy may comprise a 3 to 3.9 weight percent iron, such as 3 to 3.7 weight percent, for example 3.2 to 3.5 weight percent iron, 96.1 to 97 weight percent chromium, such as 96.5 to 96.8 weight percent chromium, and residual or unavoidable impurities. This alloy may provide an improved CTE match to larger area solid oxide fuel and electrolyzer cells. Other metals and metal alloys which have the desired properties for particular electrolytic cell materials may also be used.

A method of making the interconnect for an electrolytic cell stack, such as a fuel cell or electrolyzer stack, includes forming the interconnect using any suitable method. In one embodiment, the interconnect may be formed by a powder metallurgy technique in which a metal powder is provided into a die cavity of a powder press. The powder may comprise a mixture of elemental iron and chromium powders or a pre-alloyed chromium powder. The powder in the die cavity may contain 3 to 6 weight percent iron, 0 to 1 weight percent or less yttrium, such as 200 to 2000 micrograms/gram of Y, with the balance including chromium and residual or unavoidable impurities. The powder in the die cavity is then compressed by the die (i.e., one or more punches) of the powder press to form a green interconnect. Preferably, sufficient pressure is provided to the powder such that the finished interconnect (e.g., after the green interconnect is sintered) has a density of at least 6.5 grams per cubic centimeters, such as 6.55 to 6.65 grams per cubic centimeter.

The embodiment method also includes creep flattening and optionally oxidizing a metal interconnect during the creep flattening prior to providing the interconnect into the electrolytic cell stack. The creep flattened, pre-oxidized interconnect may comprise a free standing interconnect that has not been incorporated into the electrolytic cell stack. The interconnect may then be provided into the electrolytic cell stack, such as a fuel cell or electrolyzer stack, after the interconnect has been creep flattened and optionally oxidized. The interconnect may then be located between two fuel cells or two electrolyzer cells in the stack and the interconnect may be configured to electrically connect the two fuel cells or electrolyzer cells to one another.

At least one dimension of the metal interconnect may change during the process of creep flattening and optional oxidizing. The size of the interconnect may increase along one or more dimensions during the creep flattening and optional oxidation process. For example, for a plate shaped interconnect (i.e., an interconnect having a thickness that is at least one order of magnitude smaller than its width or length), the thickness of the interconnect may increase by at least 0.02%, such as by about 0.1% to about 0.9%, after the process of creep flattening and oxidation. At least surface portions of the interconnect, and optionally pores throughout the thickness of the interconnect may be oxidized to form a metal oxide. For a Cr—Fe interconnect (i.e., Cr—Fe—Y interconnect in which Y is zero weight percent), the oxidation may form a chromium and/or iron oxide on at least the surface of the interconnect, and optionally in interior pores of the interconnect.

In general, the oxidation may be conducted for a sufficient time such that the interconnect does not substantially further oxidize after it is provided into the stack and exposed to an oxidizing ambient during stack operation. In other words, the interconnect may be oxidized to at least 99% of its maximum possible oxidation amount during the oxidation step. Thus, the preoxidized metal interconnect may not substantially further oxidize upon exposure to a subsequent oxidizing ambient at a temperature of at least 800° C. prior to or after being provided into the stack.

In some embodiments, the interconnect may be oxidized twice. The interconnect may initially be oxidized without a mechanical load being imposed on the interconnect (i.e., separately from the creep flattening). The optional initial oxidation process may be conducted at an elevated temperature in an oxidizing ambient. For example, for a Cr—Fe—Y interconnect, the initial oxidation may be conducted for at least about 18 hours at a temperature of at least 900° C. in air and/or in oxygen, such as for 20 to 200 hours, for example 168 hours, in air at a temperature of 950° C. Higher temperature, such as 951 to 1050° C., for example, may also be used. Other temperatures and oxidation durations may be used for other interconnect materials. Thus, the initial oxidation of the interconnect is conducted in the oxidizing ambient at a temperature above room temperature prior to the creep flattening. In other embodiments, the initial oxidation step is omitted.

In a first embodiment, interconnects may subjected to the above described initial oxidation to form a metal oxide on the interconnect surfaces without applying a mechanical load on the interconnects. The metal oxide is then removed from the interconnect surfaces by any suitable method, such as grit blasting. The interconnects may then be creep flattened. During the creep flattening process, the interconnects may be subjected to a load that is in range from 100 lb. to 500 lb. Furthermore, during the creep flattening processes, the interconnects may be subjected to a temperature in a range from approximately 920° C. to approximately 1000° C. for 4 to 60 hours, such as 4 to 8 hours at a temperature above 950° C. It is believed that the creep flattening time versus temperature relationship is non-linear. Thus, creep flattening at 960° C. may be conducted for 4 hours to achieve similar interconnect flatness improvement as creep flattening conducted at 940° C. for 48 hours. Preferably, the creep flattening is conducted in an oxidizing (e.g., air, oxygen or water vapor) environment (e.g., ambient) to further oxidize the pores in the interconnect and increase the density of the interconnect.

After the creep flattening, the air side ribs 406 of the interconnect may be coated with at least one of lanthanum strontium manganite (LSM) or (Mn, Co)₃O₄ spinel (MCO) on air-side ribs 406 located in an air flow field of the interconnect 400, which is referred to as an LSM/MCO coating (e.g., LSM coating, MCO coating, or both LSM and MCO coating) 801 (shown in FIGS. 8B and 8D). Thus, in the first embodiment, the step of removing the metal oxide from the surface of the interconnect 400 occurs after the initial oxidation and before the creep flattening, while forming the coating 801 occurs after the creep flattening.

In a second embodiment, the order of coating and creep flattening is reversed compared to the first embodiment. As in the first embodiment, the interconnects may be initially oxidized and then grit blasted to remove the metal oxide from surfaces of the interconnects 400. The air-side ribs 406 may then be coated with the LSM/MCO coating 801 after grit blasting but before the creep flattening in this second embodiment. The interconnects may then be creep flattened after the coating. In the second embodiment, the interconnects may be subjected to a temperature in a range from approximately 940° C. to approximately 960° C. for 4 to 60 hours in air under a 100 lb. to 500 lb. load during the creep flattening. Thus, in the second embodiment, the step of removing the metal oxide occurs after the initial oxidation and before the creep flattening, while the step of forming the coating occurs after the removing the metal oxide and before the creep flattening.

In a third embodiment, the order of grit blasting and creep flattening is reversed compared to the first embodiment. As in the first embodiment, the interconnects may be initially oxidized. In this third embodiment, the interconnects are creep flattened after the initial oxidation and before the grit blasting. In the third embodiment, the interconnects may be subjected to a temperature in a range from approximately 940° C. to approximately 960° C. for 4 to 60 hours in air under a 100 lb. to 500 lb. load during the creep flattening. The interconnects may then be grit blasted to remove the metal oxide from surfaces of the interconnects, and the air-side ribs 406 may then be coated with the LSM/MCO coating 801 after the grit blasting. Thus, in the third embodiment, the step of creep flattening occurs after the initial oxidation and before removing the metal oxide, and the step of removing the metal oxide occurs after the creep flattening and before the forming the coating.

In a fourth embodiment, the oxidation and creep flattening are combined in a single process step. In other words, the initial oxidation step is omitted, and the interconnects are oxidized in a single creep flattening step conducted in the oxidizing ambient. In this fourth embodiment, the interconnects are first subjected to the combined oxidation/creep flattening process. In the fourth embodiment, the interconnects may be subjected to a temperature in a range from approximately 920° C. to approximately 1100° C. for 4 to 60 hours in air under a 100 lb. to 500 lb. load during the combined creep flattening/oxidation. The interconnects may then be grit blasted to remove metal oxide from surfaces of the interconnects, and the air-side ribs 406 may then be coated with the LSM/MCO coating 801. Thus, in the fourth embodiment, the step of removing the metal oxide occurs after the creep flattening and before the forming the coating.

In the first through fourth embodiments described above, the elevated temperature of the creep flattening is 920° C. to 1100° C., the load applied during the creep flattening comprises a 100 to 500 pound load, and the creep flattening is conducted for 4 to 60 hours. By performing the two step or the one step oxidation process as described above, dimensions of the interconnect may not substantially change after the step of oxidation when the interconnect is exposed to a subsequent oxidizing ambient before or during stack operation (i.e., before or after being inserted into the stack). Thus, the interconnect dimensions may change by less than 0.02% when the interconnect is exposed to a subsequent oxidizing ambient at an elevated temperature, such as at a temperature above 800° C. for at least 5 hours, such as for 20 to 168 hours. Therefore, the interconnect may not further substantially deform during the initial stack operation at an elevated temperature in an oxidizing ambient and may not damage adjacent cells of the stack. In contrast, if the interconnect is not pre-oxidized before being inserted into the stack, then it may be subjected to the deformation inside the stack during the initial stack operation at an elevated temperature in an oxidizing ambient. This deformation may cause damage (e.g., cracks 702) to the adjacent cells of the stack.

FIG. 8A is a vertical cross-sectional view of a portion of the interconnect 400 of FIG. 7 , and FIG. 8B is a vertical cross-sectional view of the portion of the interconnect 400 of FIG. 8A after the LSM/MCO coating 801 has been applied to air side ribs 406, according to a fifth embodiment. The cross-section defining the view of FIGS. 8A and 8B is indicated by the line B-B′ in FIG. 7 . In this fifth embodiment, the air-side ribs 406 are recessed from a flat edge portion 804 of the interconnect 400. The flat edge portion 804 may comprise an inner portion of the riser seal surface 422 which is located adjacent to the air-side ribs 406, as shown in FIG. 7 . The flat edge portion 804 is taller than the tops of the air side ribs 406 by a first distance 802. The first distance 802 may be a distance from a horizontal plane 803 at the top surface of the air side ribs 406 to a horizontal plane 805 at the top of the edge surface portion 804. The first distance 802 may be in a range from approximately 85 microns to 100 microns. Thus, the ribs 406 are offset below the flat edge portion 804.

As shown in FIG. 8B, the air side ribs 406 may be coated with the LSM/MCO coating 801 as described above, while the flat edge portion 804 is not coated with the coating 801. The LSM/MCO coating 801 may have a thickness in a range from approximately 85 microns to 100 microns. Thus, in one embodiment, the ribs 406 are offset below the flat edge portion 804 by a height that is substantially equal to (i.e., is within 0 to 10% of) the thickness of the coating 801. After formation of the LSM/MCO coating 801, the air-side ribs 406 and the (uncoated) flat edge portion 804 may have a common height 806 (i.e., the top surface of the LSM/MCO coating 801 on the top surface of the ribs 406 and the top surface of the flat edge portion 804 are located in the same horizontal plane 806), as shown in FIG. 8B.

FIG. 8C is a vertical cross-sectional view of a portion of the interconnect of FIG. 7 having a different height profile from that of FIG. 8A, and FIG. 8D is a vertical cross-sectional view of the portion of the interconnect of FIG. 8C after a the LSM/MCO coating 801 has been applied to air side ribs 406, according to a sixth embodiment. The cross-section defining the view of FIGS. 8C and 8D is also indicated by the line B-B′ in FIG. 7 . As shown in FIG. 8C, the flat edge portion 804 and the air-side ribs 406 have a uniform height 806 prior to the LSM/MCO coating 801 deposition. In other words, the uncoated top surfaces of the ribs 406 and the flat edge portion 804 are located in the same horizontal plane 806.

As shown in FIG. 8D, the air side ribs 406 may be coated with the LSM/MCO coating 801. The LSM/MCO coating 801 may have a thickness in a range from approximately 85 microns to 100 microns. Therefore, after formation of the LSM/MCO coating 801, the coated air side ribs 406 may be taller than the flat edge portion 804 by a second distance 808 that is in a range from approximately 85 microns to 100 microns as shown, for example, in FIG. 8D. The second distance 808 may be a distance from the horizontal plane 807 at the top surface of the LSM/MCO coating 801 located on the air-side ribs 406 to the horizontal plane 805 at the top surface of the edge surface portion 804.

As described above, the difference in height (i.e., the second distance 808) may allow the riser seal surfaces 422 to be recessed with respect to the tops of the coated air-side ribs 406. In other words, when the air side of the interconnect 400 is viewed from above, the riser seal surfaces 422 may be lower than the tops of the LSM/MCO coating 801 coated ribs 406. For example, the riser seal surfaces 422 may be recessed by from about 85 microns to about 100 microns with respect to a plane extending across the tips of the coated ribs 406. The larger recess of the flat edge portion 804 may allow a thicker riser seal 424 (shown in FIG. 6A) to be formed on the riser seal surfaces 422. Thicker riser seals 424 may be more compliant due to their increased thickness and may allow increased thermal deformation without generating large tensile stresses that may otherwise lead to the formation of the cracks 702 in the SOFCs 310.

In the sixth embodiment, the air side of the interconnect 400 includes riser seal surfaces 422 disposed on two opposing sides of the air flow field and which surround the fuel inlets 402 and outlets 404. The riser seal surfaces 422 (e.g., the top surface of the flat edge portion 804) are recessed with respect to a plane 807 extending across a top surface of the coating 801 on tips of the air-side ribs 406. In the electrochemical stack 300, a glass or a glass-ceramic seal 424 is located between the respective electrochemical cell (e.g., SOEC or SOFC 310) and the riser seal surface 422 of a respective adjacent interconnect 400 of the plurality of the interconnects 400 in the stack 300.

Fuel cell systems of the embodiments of the present disclosure are designed to reduce greenhouse gas emissions and have a positive impact on the climate.

While solid oxide fuel cell interconnects, end plates, and electrolytes are described above in various embodiments, embodiments may include any other fuel cell interconnects or end plates, such as molten carbonate, phosphoric acid or PEM fuel cell electrolytes, interconnects or end plates, or any other shaped metal or metal alloy or compacted metal powder or ceramic objects not associated with fuel cell systems, such as electrolyzer interconnects.

The foregoing descriptions are provided merely as illustrative examples and are not intended to require or imply that the steps of the various embodiments must be performed in the order presented. As will be appreciated by one of skill in the art the order of steps in the foregoing embodiments may be performed in any order. Words such as “thereafter,” “then,” “next,” etc. are not necessarily intended to limit the order of the steps; these words may be used to guide the reader through the description of the methods. Further, any reference to claim elements in the singular, for example, using the articles “a,” “an” or “the” is not to be construed as limiting the element to the singular. Further, any step or component of any embodiment described herein can be used in any other embodiment.

The preceding description of the disclosed aspects is provided to enable any person skilled in the art to make and/or use the disclosed embodiments. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the disclosure. Thus, embodiments of the disclosure are not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. 

1. A method of making an interconnect for an electrochemical cell stack, comprising: providing the interconnect; and creep flattening the interconnect prior to placing the interconnect into the electrochemical cell stack.
 2. The method of claim 1, wherein the creep flattening is conducted at an elevated temperature under a load.
 3. The method of claim 2, wherein: the elevated temperature comprises 920° C. to 1100° C.; the load comprises a 100 to 500 pound load; and the creep flattening is conducted for 4 to 60 hours.
 4. The method of claim 2, wherein the creep flattening is conducted in an oxidizing ambient such that the interconnect is oxidized during the creep flattening.
 5. The method of claim 4, further comprising: removing a metal oxide from a surface of the interconnect; and forming a coating comprising at least one of lanthanum strontium manganite (LSM) or (Mn, Co)₃O₄ spinel (MCO) on air-side ribs located in an air flow field of the interconnect.
 6. The method of claim 5, further comprising performing an initial oxidation of the interconnect in the oxidizing ambient at a temperature above room temperature prior to the creep flattening.
 7. The method of claim 6, wherein: the removing the metal oxide occurs after the initial oxidation and before the creep flattening; and the forming the coating occurs after the creep flattening.
 8. The method of claim 6, wherein: the removing the metal oxide occurs after the initial oxidation and before the creep flattening; and the forming the coating occurs after the removing the metal oxide and before the creep flattening.
 9. The method of claim 6, wherein: the creep flattening occurs after the initial oxidation and before removing the metal oxide; and the removing the metal oxide occurs after the creep flattening and before the forming the coating.
 10. The method of claim 5, wherein the removing the metal oxide occurs after the creep flattening and before the forming the coating.
 11. The method of claim 5, wherein: the air side further comprises riser seal surfaces disposed on two opposing sides of the air flow field and which surround the fuel inlets and outlets; and the riser seal surfaces are recessed with respect to a plane extending across a top surface of the coating on tips of the air-side ribs.
 12. The method of claim 1, wherein: the interconnect comprises a chromium alloy comprising 3 to 6 weight percent iron, 0 to 1 weight percent yttrium, and 94 to 97 weight percent chromium; the interconnect has a density of at least 6.5 grams per cubic centimeters; and the interconnect is formed by a powder metallurgy method.
 13. The method of claim 12, wherein the interconnect comprises the chromium alloy comprising 3 to 3.9 weight percent iron, and 96.1 to 97 weight percent chromium.
 14. The method of claim 1, further comprising placing the interconnect into the electrochemical stack after the creep flattening, wherein the electrochemical stack comprises a solid oxide fuel cell stack containing solid oxide fuel cells, or a solid oxide electrolyzer cell stack containing solid oxide electrolyzer cells.
 15. An interconnect for an electrochemical cell stack, comprising: fuel inlets and outlets that extend through the interconnect adjacent to opposing first and second peripheral edges of the interconnect; an air side comprising an air flow field comprising air-side ribs and air channels that extend in a first direction, from a third peripheral edge of the interconnect to a fourth peripheral edge of the interconnect that is opposite to the third peripheral edge, and riser seal surfaces disposed on the first and second peripheral edges of the interconnect, wherein the riser seal surfaces surround the fuel inlets and outlets; a fuel side opposing the air side, the fuel side comprising a fuel flow field comprising fuel-side ribs and fuel channels that extend in a second direction substantially perpendicular to the first direction between the fuel inlets and outlets; and a coating comprising at least one of lanthanum strontium manganite (LSM) or (Mn, Co)₃O₄ spinel (MCO) located on the air-side ribs but not on the riser seal surfaces, wherein the riser seal surfaces are recessed with respect to a plane extending across a top surface of the coating on tips of the air-side ribs.
 16. The interconnect of claim 15, wherein: the coating has a thickness of about 85 to about 100 microns; and the riser seal surfaces are recessed by about 85 to about 100 microns, with respect to the plane extending across the top surface of the coating on tips of the air-side ribs.
 17. The interconnect of claim 15, wherein: the interconnect comprises a chromium alloy comprising 3 to 6 weight percent iron, 0 to 1 weight percent yttrium, and 94 to 97 weight percent chromium; the interconnect has a density of at least 6.5 grams per cubic centimeters; and the interconnect is formed by a powder metallurgy method.
 18. The interconnect of claim 17, wherein the interconnect comprises the chromium alloy comprising 3 to 3.9 weight percent iron, and 96.1 to 97 weight percent chromium.
 19. An electrochemical cell stack, comprising: a plurality of the interconnects of claim 15; a plurality of the electrochemical cells located in contact with the respective air-side ribs of the plurality of the interconnects; and a glass or a glass-ceramic seals located between the respective electrochemical cell and the riser seal surface of a respective adjacent interconnect of the plurality of the interconnects.
 20. The electrochemical cell stack of claim 19, wherein the electrochemical cells comprise solid oxide fuel cells or solid oxide electrolyzer cells.
 21. The method of claim 1, wherein the interconnect comprises: fuel inlets and outlets that extend through the interconnect adjacent to opposing first and second peripheral edges of the interconnect; an air side comprising an air flow field comprising air-side ribs and air channels that extend in a first direction, from a third peripheral edge of the interconnect to a fourth peripheral edge of the interconnect that is opposite to the third peripheral edge, and riser seal surfaces disposed on the first and second peripheral edges of the interconnect, wherein the riser seal surfaces surround the fuel inlets and outlets; a fuel side opposing the air side, the fuel side comprising a fuel flow field comprising fuel-side ribs and fuel channels that extend in a second direction substantially perpendicular to the first direction between the fuel inlets and outlets; and a coating comprising at least one of lanthanum strontium manganite (LSM) or (Mn, Co)₃O₄ spinel (MCO) located on the air-side ribs but not on the riser seal surfaces, wherein the riser seal surfaces are recessed with respect to a plane extending across a top surface of the coating on tips of the air-side ribs. 